Dymax UV/Vis curable adhesives cure quickly and provide excellent circuit protection. These resins are “cured on demand” and are ideal for manual applications where positioning accuracy and immediate bond strength are critical, such as wire positioning and coil sealing. Dymax component reinforcement and positioning materials are used to bond critical components such as ball grid arrays (BGA) and video graphics arrays (VGA) for auxiliary processes and long-term stability. This type of material can be used to help with shock and vibration in electronic assembly.