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Conductive plastic
Excellent electrical and thermal conductivity
Different curing conditions and processes can be selected according to requirements
Widely used in the microelectronics, medical, aerospace and optical industries
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key performance
exterior
viscosity / cps
curing condition
hardness
working temperature / °C
TG/℃
|
productname |
component |
viscosity cps |
operating time min |
shear strength psi |
hardness |
volume resistivity Ohm-cm |
application and features |
|
EO-20E |
2 |
2000-4000 |
2 days |
1600 |
D-75 |
＜0.0004 |
Conductive adhesive H20E corresponding product, suitable for conductive and thermal bonding of optical module |
|
EO-21 |
2 |
40000 |
60 |
3000 |
D-84 |
＜0.0004 |
Chip Mount, Microwave Equipment, Replacement Soldering, LED Solid Crystal, Imaging Equipment, LCD Bonding, Semiconductor |
|
EO-21M-5 |
2 |
1500 |
180 |
1700 |
D-75 |
＜0.0006 |
Microwave equipment, alternative welding, LED solid crystal, imaging equipment, LCD internal connection, substrate connection, low stress occasion |
|
EO-24 |
2 |
3000 |
2天 |
1400 |
D-75 |
＜0.0004 |
Patch, LED solid crystal, quartz bonding, flip chip, low stress applications, meet NASA gas emission requirements |
|
EO-30M-1 |
2 |
Paste |
180 |
2000 |
D-72 |
＜0.001 |
MCM/hybrid patch, LED solid crystal, low stress occasion, EMI/RFI shielding, imaging equipment |
|
EO-38M-3 |
2 |
35000 |
>1 day/span> |
1700 |
D-88 |
＜0.0004 |
High temperature resistant, imaging equipment, LED solid crystal, microwave equipment, LCD internal connection, substrate connection, patch |
|
EO-83M-2 |
1 |
14000 |
>4 weeks |
1600 |
D-88 |
＜0.0002 |
Chip Mount, Microwave Equipment, Substrate Connection, Medical Equipment, Semiconductor Patch, MEMS Device |
|
EO-97M |
1 |
12000 |
>4 weeks |
1300 |
D-89 |
＜0.0004 |
Chip mounting, microwave equipment, substrate connection, alternative soldering |
|
EO-98HT |
1 |
55000 |
>4 weeks |
1200 |
D-85 |
＜0.0004 |
High temperature resistance, imaging equipment, substrate connection, microwave equipment, LCD interconnection, chip mounting |
Recommended
Summary information
A new generation of bisphenol A-free structural adhesives to meet higher environmental requirements
High bond strength, high toughness
Widely used in the bonding of metal, plastic, glass, ceramic and other substrates
Summary information
One-component, UV fast curing into elastic strips
Replace silicone foam gasket
Flexible and convenient sizing process
Suitable for mobile phone waterproof, TV frame sealed shock absorption